【正文】 TELLINUSAU通用信令接入單元 技術手冊 目 錄 i 目 錄 第 1章 產(chǎn)品簡介 ................................................................................................................... 11 網(wǎng)絡發(fā)展與需求 .........................................................................................................11 產(chǎn)品定位 ...................................................................................................................11 產(chǎn)品特點 ...................................................................................................................13 高性能鏈路接入和處理能力 ...............................................................................13 支持多設備接 入 ................................................................................................13 開放的協(xié)議接口 ................................................................................................13 高可靠性設計 ...................................................................................................14 支持集中網(wǎng)管 ...................................................................................................14 方便實用的操作維護功能 ..................................................................................15 平滑擴容 ..........................................................................................................15 升級方便 ..........................................................................................................16 第 2章 硬件系統(tǒng) ................................................................................................................... 21 概述 ..........................................................................................................................21 系統(tǒng)邏輯結構 ...................................................................................................21 系統(tǒng)工作流程 ...................................................................................................25 硬件單元結構 ...................................................................................................26 功能模塊與硬件單元的對應關系 ........................................................................28 機柜 ..........................................................................................................................28 機柜物理特性 ...................................................................................................28 機柜內(nèi)部組件 ...................................................................................................29 綜合配置機柜 ................................................................................................. 210 業(yè)務處理機柜 ................................................................................................. 211 插框 ........................................................................................................................ 213 插框物理特性 ................................................................................................. 213 基本框 ........................................................................................................... 213 擴容框 ........................................................................................................... 215 單板 ........................................................................................................................ 216 單板簡介 ........................................................................................................ 216 SMU（系統(tǒng)管理板） ...................................................................................... 217 WCCU/WCSU（呼叫控制及信令處理板） ....................................................... 218 IFM（ IP 轉發(fā)模塊板） .................................................................................... 220 BSG (寬帶信令處理板 ) ................................................................................... 221 ALU（告警板） .............................................................................................. 221 UPWR（二次電源板） ................................................................................... 223 SIU（系統(tǒng)接口板） ........................................................................................ 224 TELLINUSAU通用信令接入單元 技術手冊 目 錄 ii HSC（熱插拔控制板） ................................................................................... 225 CKI（時鐘接口板） ........................................................................................ 227 EPI（ E1 池接口板） ..................................................................................... 228 BFI（后插 FE 接口板） ................................................................................. 230 操作維護子系統(tǒng)硬件 ................................................................................................. 231 BAM 服務器 ................................................................................................... 231 工作站 ........................................................................................................... 231 告警箱 ........................................................................................................... 232 LAN Switch.................................................................................................... 232 系統(tǒng)典型配置 ........................................................................................................... 233 寬帶信令接入的典型配置 ................................................................................ 233 窄帶信令接入的典型配置 ................................................................................ 234 第 3章 軟件系統(tǒng) ................................................................................................................... 31 主機軟件 ...................................................................................................................31 OMC 軟件 ................................................................................................................