pcb生產(chǎn)流程基礎(chǔ)知識(shí)培訓(xùn)(已修改)
2025-03-20 16:48 本頁(yè)面
【正文】 1 PCB生產(chǎn)流程基礎(chǔ)知識(shí)培訓(xùn) 2 1. PCB生產(chǎn)流程工序圖片介紹 2. 生產(chǎn)制程說明 3 、內(nèi)層圖形 (Inner Layer Pattern) 開料 （板料） (Panel Cutting) 完成內(nèi)層 (Finished Inner Lauer) 對(duì)位 (Registration) 顯影 蝕刻 退膜 (DevelopingEtching Peeling Film) 內(nèi)層清洗 (Inner Layer Cleaning ) AOI 檢查 修板 (Automatic Optical InspectionRepairing) QC檢查 (QC Inspection) 貼膜 (Jointing Dryfilm) 濕膜 (Printing Wetfilm) 曝光 (Exposure) 下工序 (Next Process) 4 棕化 (Brown Oxidized ) 內(nèi)層板 (Inner Layer PCB) 疊層 (Layup ) 鉆靶孔 (Drilling Target Hole ) 銑靶標(biāo) (Routing Target ) 銑邊框 (Routing Frame ) 、壓合 (Lamination) 開半固化片 (Prepreg Cutting) 棕化板 (Finished . ) 開銅箔 (Copper Cutting ) 下工序 (Next Process) 壓合 (Lamination ) 5 鉆孔 (Drilling) QA檢查 (QA Inspection ) 已鉆孔 (Been Drilled) 、鉆孔 (Drilling) 待鉆孔 (Waiting Drilling) 下工序 (Next Process) 6 、化學(xué)鍍銅 (Plated Through Hole) 磨板 (Grinding Board) 化學(xué)沉銅 (Loading PTH ) 除膠 (Dismear ) 活化 (Activation ) 化學(xué)沉銅 (Plated Through Hole ) 整板電鍍 (Panel Plating ) 下工序 (Next Process) 已鉆孔 (Finished Drilling ) 加速 (Accelerating ) 7 、圖象轉(zhuǎn)移 (Dry Film) 磨板 (Grinding PCB ) 貼膜 (Jointing Dryfilm) 對(duì)位 (Registration) 來料 (Ining PCB) 曝光 (Exposure) 顯影 (Developing) QC檢查 (QC Inspection) 完成干膜 (Finished Dry Film) 下工序 (Next Process) 8 、圖形電鍍 蝕刻 (Pattern PlatingEtching) QC檢查 (QC Inspection ) 圖形電鍍 (Pattern Plating ) 待蝕刻 (Finished Plating ) 退膜 (Peeling Dryfilm ) 蝕刻 (Etching ) 褪錫 (Removing Tin ) 完成蝕刻（半成品） (Finished Etching ) 干膜板 (Finished Dryfilm ) 下工序 (Next Process) 9 、阻焊 (Soldermask) 預(yù)烘 (Preheating) 絲印阻焊 (Printing Soldermask) 對(duì)位 (Registration) 曝光 (Exposure) 顯影 (Development) 后固化
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