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基于arm的嵌入式溫度控制系統(tǒng)設(shè)計(已修改)

2024-11-23 22:11 本頁面
 

【正文】 南 京 工 程 學(xué) 院 畢業(yè)設(shè)計說明書 (論文 ) 作 者: 韓勵 學(xué) 號: 240102416 系 部: 通信工程學(xué)院 專 業(yè): 通信工程( 計算機(jī)通信 ) 題 目: 基于 ARM的嵌入式溫度控制系統(tǒng)的設(shè)計 指導(dǎo)者: 袁璟 副教授 評閱者: 2020 年 5 月 南 京 Design of Embedded Control System of Temperature Based on ARM A Dissertation Submitted to Nanjing Institute of Technology For the Academic Degree of Bachelor of Science By Li Han Supervised by Associate Professor Jing Yuan College of Communication Engineering Nanjing Institute of Technology March 2020 南京工程學(xué)院畢業(yè)設(shè)計(論文) 摘要 溫度的測量和控制在工業(yè)生產(chǎn)中有廣泛的應(yīng)用,尤其在石油、化工、電力、冶金等工業(yè)領(lǐng)域中,對溫度的測量和監(jiān)控是非常重要的一個環(huán)節(jié),溫度參數(shù)是工業(yè)控制中的一項重要的指標(biāo)。 本文主要研究了基于 ARM7 架構(gòu)的嵌入式系統(tǒng) 對于溫度控制 的應(yīng)用 , 它基于 ARM7 內(nèi)核的 LPC2124, 以 DS1820 采集溫度信號 , 通過 RWB 溫度變送器和 A/D 轉(zhuǎn)換獲得實際溫度值 , 同時通過 LCD 實時顯示 。 此溫度控制系統(tǒng)應(yīng)用于熱電儀 , 實際應(yīng)用表明 , 系統(tǒng)穩(wěn)定、可靠 , 滿足了熱電儀的溫度控制要求。 關(guān)鍵詞: ARM; Proteus; 嵌入式系統(tǒng) ; 溫度控制系統(tǒng) 南京工程學(xué)院畢業(yè)設(shè)計(論文) Abstract Measurement and control of temperature is widely used in industrial production, especially in the petroleum, chemical, electric power, metallurgy and other industrial fields, measurement a nd monitoring of the temperature is a very important link, the temperature parameter is an important index in industrial control. This paper mainly studies the ARM7 based embedded system for the application of temperature control based on ARM7, which based on the LPC2124 kernel, the DS1820 collecting temperature signal, to obtain the actual temperature value through the RWB temperature transmitter and A/D conversion, at the same time through the LCD real time display。 This paper introduces the principle , the system implementation process, gives some application circuits. This temperature control system used in the power system, the practical application shows that the system is stable and reliable, meet, the thermoelectric instrument temperature control requirements. Key words: ARM; Proteus; Embedded system; Temperature control system 南京工程學(xué)院畢業(yè)設(shè)計(論文) 目錄 第一章 緒論 .......................................................................................................................... 1 引言 .......................................................................................................................... 1 選題背景與 意義 ...................................................................................................... 1 研究現(xiàn)狀 .................................................................................................................. 2 論文主要研究內(nèi)容 ................................................................................................... 3 主要章節(jié)安排 .......................................................................................................... 3 第二章 開發(fā)工具的介紹 ....................................................................................................... 4 Proteus 的功能 .......................................................................................................... 4 Proteus 的功能簡述 ......................................................................................... 4 資源豐富 ........................................................................................................ 5 電路仿真 ......................................................................................................... 5 ...................................................................................................................... 6 ADS種類 ........................................................................................................... 6 軟件組成 .......................................................................................................... 6 第三章 軟硬件介紹 .............................................................................................................. 8 ARM .......................................................................................................................... 8 ARM 簡介 ....................................................................................................... 8 ARM7 .............................................................................................................. 8 處理器 ........................................................................................................ 9 ..................................................................................................... 9 特性 ................................................................................................................. 9 結(jié)構(gòu) ................................................................................................................. 9 ......................................................................................................... 10 硬件系統(tǒng)的整體結(jié)構(gòu) .............................................................................................. 11 ........................................................................................ 11 ........................................................................................ 12 基本硬件組成 ................................................................................................ 12 第四章 軟件設(shè)計 ................................................................................................................ 17 系統(tǒng)軟件的整體結(jié)構(gòu) .............................................................................................. 17 ......................................................................................................... 18 .............
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