半導體封裝制程與設備材料知識介紹-fe(已修改)
2025-05-26 12:03 本頁面
【正文】 半導體封裝制程與設備材料知識簡介 Prepare By： William Guo 2021 . 11 Update 半導體封裝制程概述 半導體前段晶圓 wafer制程 半導體后段封裝測試 封裝前段（ B/GMOLD）－ 封裝后段（ MARKPLANT）－ 測試 封裝就 是將前製程加工完成後所提供晶圓中之每一顆 IC晶粒獨立分離，並外接信號線至導線架上 分離 而予以包覆 包裝測試直至 IC成品 。 半 導 體 制 程 Oxidization (氧化處理 ) Lithography (微影 ) Etching (蝕刻 ) Diffusion Ion Implantation (擴散離子植入 ) Deposition (沉積 ) Wafer Inspection (晶圓檢查 ) Grind amp。 Dicing (晶圓 研磨及 切割 ) Die Attach (上片 ) WireBonding (焊線 ) Molding (塑封 ) Package (包裝 ) Wafer Cutting (晶圓切斷 ) Wafer Reduce (晶圓減薄 ) Laser Cut amp。 package saw (切割 成型 ) Testing (測試 ) Laser mark (激光印字 ) IC制造開始 前段結束 后段封裝開始 製造完成 封 裝 型 式 (PACKAGE) Through Hole Mount Shape Material Lead Pitch No of I/O Typical Features Ceramic Plastic mm (100miles) 8 ~64 DIP Dual Inline Package Plastic mm (100miles) 1 direction lead 3~25 SIP Single Inline Package 封 裝 型 式 Through Hole Mount Shape Material Lead Pitch No of I/O Typical Features Plastic mm (100miles) 1 direction lead 16~24 ZIP Zigzag Inline Package Plastic mm (70miles) 20 ~64 SDIP Shrink Dual Inline Package 封 裝 型 式 Through Hole Mount Shape Material Lead Pitch No of I/O Typical Features Ceramic Plastic mm (100miles) halfsize pitch in the width direction 24~32 SKDIP Skinny Dual Inline Package Ceramic Plastic mm (100miles) PBGA Pin Grid Array 封 裝 型 式 Surface Mount Shape Material Lead Pitch No of I/O Typical Features Plastic mm (50miles) 2 direction lead 8 ~40 SOP Small Outline Package Plastic , , mm 4 direction lead 88~200 QFP QuadFlat Pack 封 裝 型 式 Surface Mount Shape Material Lead Pitch No of I/O Typical Features Ceramic , mm (50, 30miles) 2, 4 direction lead 20~80 FPG Flat Package of Glass Ceramic , mm (50, 40, 30 miles) 20~40 LCC Leadless Chip Carrier 封 裝 型 式 Surface Mount Shape Material Lead Pitch No of I/O Typical Features Ceramic mm (50miles) jshape bend 4 direction lead 18~124 PLCC Plastic Leaded Chip Carrier Ceramic mm 32~200 VSQF Very Small Quad Flatpack Assembly Main Process Die Cure (Optional) Die Bond Die Saw Plasma Card Asy Memory Test Cleaner Card Test Packing for Outgoing Detaping (Optional) Grinding (Optional) Taping (Optional) Wafer Mount UV Cure (Optional) Laser mark Post Mold Cure Molding Laser Cut Package Saw Wire Bond SMT (Optional) 半導體設備供應商介紹 前道部分 PROCESS VENDOR MODEL SMT PRINTER DEK HOR2I SMT – CHIP MOUNT SIMENS HS60 TAPING NITTO DR3000III INLINE GRINDER
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