【正文】 軟件模塊的分配需求 ...................................................................................................13 軟件模塊的開發(fā)狀態(tài) /類型 ...........................................................................................13 外包、外購的所有軟件模塊的規(guī)格 ..............................................................................13 8 子系統(tǒng)設(shè)計規(guī)格（硬件類） ......................................................................................................13 子系統(tǒng)架構(gòu) .................................................................................................................13 子系統(tǒng)運行概念 ..........................................................................................................14 硬件的模塊間接口 ......................................................................................................14 硬件的模塊分配需求 ...................................................................................................14 硬件的模塊的開發(fā)狀態(tài) /類型 .......................................................................................15 外包、外購的所有硬件模塊的規(guī)格 ..............................................................................15 9 專項設(shè)計 ..................................................................................................................................16 可靠性規(guī)格 .........................................................................................................................16 可靠性指標(biāo)規(guī)格 ..........................................................................................................16 器件降額合格率 ..........................................................................................................16 故障管理規(guī)格 .............................................................................................................16 環(huán)境規(guī)格 ............................................................................................................................17 產(chǎn)品環(huán)境總體性能指標(biāo) ...............................................................................................17 產(chǎn)品環(huán) 境適應(yīng)性設(shè)計方案 ............................................................................................17 安規(guī)規(guī)格 ............................................................................................................................18 電磁兼容與防雷 ..................................................................................................................18 產(chǎn)品 EMC總體性能指標(biāo) ...............................................................................................18 電磁兼容設(shè)計方案 ......................................................................................................18 產(chǎn)品防雷總體性能指標(biāo) ...............................................................................................19 防雷設(shè)計方案 .............................................................................................................19 接地設(shè)計方案 .............................................................................................................19 電纜設(shè)計 ............................................................................................................................19 系統(tǒng)電纜連接圖 ..........................................................................................................19 接地系統(tǒng)電纜設(shè)計 ......................................................................................................20 信號系統(tǒng)電纜設(shè)計 ......................................................................................................20 信號完整性工程設(shè)計 ...........................................................................................................20 系統(tǒng)模塊劃分 .............................................................................................................20 系統(tǒng)互連設(shè)計方案 ......................................................................................................20 關(guān)鍵總線分析 .............................................................................................................20 關(guān)鍵元器件的應(yīng)用分析 ...............................................................................................20 物理實現(xiàn)關(guān)鍵技術(shù)分析 ...............................................................................................20 單板熱設(shè)計 .........................................................................................................................20 關(guān)鍵器件熱性能參數(shù) ...................................................................................................20 產(chǎn)品單板及系統(tǒng)配置功耗 ............................................................................................21 關(guān)鍵器件工作溫度范圍 ...............................................................................................21 單板的三防 設(shè)計 ..................................................................................................................21 10 工業(yè)設(shè)計 ............................................................................................................................21 產(chǎn)品 PI形象定位描述 ...........................................................................................................21 標(biāo)識系統(tǒng)與視覺傳達(dá) ...........................................................................................................21 客戶特殊需求的實現(xiàn)方式 ....................................................................................................22 11 結(jié)構(gòu)設(shè)計 ............................................................................................................................22 結(jié)構(gòu)設(shè)計基本設(shè)計思想 .......................................................................................................22 結(jié)構(gòu)詳細(xì)描述 .....................................................................................................................22 系統(tǒng)結(jié)構(gòu)配置 .............................................................................................................22 結(jié)構(gòu)設(shè)計標(biāo)準(zhǔn)及外形尺寸 ............................................................................................23 工程安裝設(shè)計描述 .............................