【正文】 ryStyle Pick Place216。 Employ X Yaxis beams to move a placement head to a specific location over a printed circuit board (PCB) that is clamped into a fixed position prior to placement167。 (3) Massively Parallel System216。 Series of small, individual placement sectionFeeder TableFeeder TableFeeder Table321 CH0 Slide18Placement Module Training Intel Confidential ( for internal usage only) Items Traditional Turret SystemTraditional GantryStyle Pick PlaceMassively Parallel 1 Head Movement Fixed rotating Movable Movable2 Head Structure Circular multiple head1 or 2 heads Multiple single head3 Part Supply MovementMovable Stationary Stationary4 Table Movement Movable Stationary Stationary5 Oddform CapabilityNone Good Good6 Placement Speed Fast Low Medium7 Chip Placement Good Good Best8 Active Component PlacementPoor Best Good9 Flexibility Medium Best Medium CH0 Slide19Placement Module Training Intel Confidential ( for internal usage only) No. Items Backlight Frontlight Laser1 Light Source From Top From Bottom From Side2 Scanning MethodTop Outline Ball / Lead Side Outline2 Accuracy Good Best Good3 Applicable ComponentPassives Leaded / BGA / CSPPassivel 3 types of vision system in general:167。 Backlight167。 Front light167。 Laser CH0 Slide20Placement Module Training Intel Confidential ( for internal usage only) No. Process Step Purpose1 Board TransportIn Transport board into machine for part placement2 Board Positioning Hold board firmly in position3 Fiducial Scanning Identify actual board location4 Part InPosition Part is ready in pickup position5 Part Pickup Pick up part6 Part Recognition Recognize the pickup part7 Part Alignment Align part placement if offseted/skewed8 Part Placement Place part on board9 Board TransportOut Transport board out of machine after part placementstep1 Step 3 CH0 Slide21Placement Module Training Intel Confidential ( for internal usage only) Step 5 Step 8Simulation CH0 Slide22Placement Module Training Intel Confidential ( for internal usage only) l 0402 or 0201 technology for smaller ponent that can contribute to higher tombstone/missing ponent. l Placement accuracy ball recognition capability for fine pitch ponentsl Thinner and smaller boards . Ex: Small form factorl Odd form or shape ponentl New packaging for I/O device such BGA , chip scale package (CSP) and flip chip CH0 Slide23Placement Module Training Intel Confidential ( for internal usage only) Chapter 1 Quiz1) Where is the placement module located after in the SMT process flow?167。 A – Screen PrintC Test167。 B – Reflow D – Wave Soldering2) Which ponent below is not placed onto the PCB by the placement machine?167。 A – Caps C THM167。 B – Transistor D – Resistor3) Which one below is not the types of placement part supply system?167。 A –Tape Reel C – Foot Print167。 B – Tray D – TubeC THM C – Foot Print CH0 Slide24Placement Module Training Intel Confidential ( for internal usage only) REVIEW SUMMARYl A placement is a equipment which pick up Surface Mount ponent and places them on a Printed Circuit Board (PCB)l 2 different type of Pick and Placement module167。 Chip shooter 167。 Fine pitchl Located after the screen print module in the SMT process flowl Placement main system consists:167。 Conveyor system167。 Part supply system167。 Pick place system167。 Vision systeml Different types of placement modules available are Fuji CP6, IP3, Universal, Phillips and etc.l Key challenges are on smaller, fine pitch odd shape part placementEnd of Chapter 1 CH0 Slide25Placement Module Training Intel Confidential ( for internal usage only) Appendix 1: NonGrid Array Placement Equipment CapabilityEquipment Supplier Model Software / Firmware Version Ball Recognition Capable % Ball Presence Inspection Correct Polarity DetectionCommentsFuji NP251 N/A YES 100% YES Fuji has provided the PD files to Intel for dist. to our QP341/351 N/A YES 100% YESFuji QP242 Cam 7 YES 100% YESFuji QP242 Cam 4 YES 50% YES Inadequate lighting.Fuji IPIII 4800/cam12 YES 100% YES MCS not capable. Need F4G or IPIII 4400/cam13 YES 100% YESPanasonic MSF N/A Partial 10% YES Current equipment can only inspect the perimeter array. Panasonic will develop 100% ball inspection for MSF MPAV2 machines for a charge – 1 month lead time.Panasonic CM402 N/A Partial 10% YESPanasonic MPAV2A/B N/A Partial 10% NOPanasonic MPAV2 N/A Partial 10% NOPanasonic MPAV N/A Partial 10% NOUniversal GSM1 N/A Partial 10% NO Center array only unless purchase UPS+ software hardware GSM2 N/A Partial 10% NOSiemens F4/F5 N/A YES 100% YESGF File avail. 32mm FOV 4 images / 2 sec per part CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement Process Spec OverviewChapter 2 CH0 Slide27Placement Module Training Intel Confidential ( for internal usage only) Placement Process Spec Course Description OBJECTIVES: Upon pletion of this topic, the participant will be able to do the following:? Find the appropriate spec for the placement module.? Navigate through the spec and use it as a reference document.? Educate how to understand Intel process and applied the knowledge when dealing with customers.Intel Malaysia Technical Training website CH0 Slide28Placement Module Training Intel Confidential ( for internal usage only) l The purpose of spec is to provide guidelines on handling equipment to ensure consistent practices among different usersl Each respective SMT module will have its own specsl A typical module will have Operation and Preventing Maintenance (PM) spec l Specs are usually breakdown into several sectionsl Typically, each module specs will consist of purpose or scope, safety, procedure or operat