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ly cost4 Lifetime cost (stability)4 Test the systemCalifornia Micro Devices 2023/3/4 下午 01:54:38 7International ESD Standards4 Human Body Model (HBM) for devices EIA/JESD22A114A ANSI/EOS/ MILSTD883 (method 3015)4 IEC 100042:1995 for systems4 Machine Model (MM) less mon EIA/JESD22A115A ANSI/EOS/4 Charge Device Model (CDM) less mon JESD22c101California Micro Devices 2023/3/4 下午 01:54:38 8Human Body Model (HBM)4 Discharge from 100pF capacitor through kOhm resistor4 6 ESD pulses 3 positive, 3 negative 1 sec separation4 Pintopin testing N(N1)/2 binations4 Used for ponent characterization4 Widely usedCalifornia Micro Devices 2023/3/4 下午 01:54:38 9HBM Current WaveformRise Time: 2 nS Tr 10 nSCalifornia Micro Devices 2023/3/4 下午 01:54:38 10IEC 100042:1995 Standard4 Discharge from 150 pF capacitor through 330 ohm resistor4 6 ESD pulses 3 positive, 3 negative4 Used for system characterization4 “Contact” v. “Air” discharge Different levels Different applicationsCalifornia Micro Devices 2023/3/4 下午 01:54:38 11IEC 100042 Current WaveformVery fast rise time: Tr 1nS60nsCalifornia Micro Devices 2023/3/4 下午 01:54:38 12IEC 100042 Test Levels4 Contact discharge is the preferred test method air discharges are not repeatable4 Air discharges used where contact discharge cannot be applied4