【正文】 cations25% of manufacturing depts. have process specifications50% of manufacturing depts. have process specificationsNonmanufacturing Manuals Developed25% of all departments have quality manuals50% of all departments have quality manualsAll Manufacturing and support depts. have controlled quality manalOther: DInstructionsWork Instructions StartedQuality Instructions Started10% Work Instructions Completed10% Quality Instructions Completed25% Work Instructions Competed, Controlled25% Quality Instructions Completed, Controlled50% Work Instructions Completed, Controlled50% Quality Instructions Completed, ControlledQuality and work Instruct. Completed, ControlledOther: ESPC Implementation IPCPC90Plan ExistsTraining StartedProcess Data Collected amp。 Philosophy Established amp。 mm Profile Tolerance mm Profile ToleranceOther: max 24 layersmax %HCoatings and Markings163。 mmTHK to TOL mmBow/Twist 163。 Alumimum BasedECore MaterialNo CorePolymerCopperAluminumGraphiteCopper Invar/CopperCopper Moly/CopperOther: FR4FCopper Thickness (Oz.)1/8 Minimum1/4 Minimum3/8 Minimum1/2 Nominal1 Nominal2 Nominal35 Max69 Max10Other: GConstruction163。 Blind ViasOther: DLaminate MaterialPhenolicEpoxy PaperEpoxy GlassModified Epoxy CompositePolyimide Film amp。 Buried ViasThru Hole Buried amp。 Immersion SilverSECTION ELECTRICAL TEST EQUIPMENTDATE COMPLETED 5/16/2006This section is intended to provide overview information on the test equipment and testing capability of the manufacturer.Site Capability Snapshot (Please Check the column that applies furthest to the right.)DesignatorsRemarksANumber of Nets200200500100020003000400050005000Other: BNumber of Nodes5005001000200030004000500060006000Other: CProbe Point Pitch [.040] [.040] [.032] [.025] [.020] [.016] [.012] [.008] [.008]Other: DTest % Single PassNone60%60%70%80%90%95%99%100%Other: EProbe Accuracy (DTP) [.008] [.008] [.006] [.005] [.004] [.003] [.003]Other: FGrid DensitySingle Side GridDouble Sided GridDouble Density GridDouble Density Double SidedQuad DensityDouble Sided Quad DensityFlying ProbeOther: GNetlist CapabilityGolden BoardIPCD356Net List ExtractionCAD/CAM Net List CompareOther: HTest Voltage20 VDC20 VDC40 VDC60 VDC80 VDC100 VDC500 VDC1000 VDC1000 VDC Other: 250VJImpedance MeasMicro SectionInboard CircuitCouponManual TDRAutomated TDROther: KImpedance ToleranceNone20%20%15%10%7%5%2%2%Other: Standard Advanced SECTION PRODUCT TYPEDATE COMPLETED 5/16/2006This section is intended to provide overview information on the printed board product types being fabricated by the manufacturer.Site Capability Snapshot (Please Check all that apply.)DesignatorsRemarksAProduct TypeRigid Printed BoardFlex Printed BoardRigid/Flex BoardRigid Back PlaneMolded ProductCeramic Printed BoardMultichip ModuleLiminated Multichip ModuleDeposited Dielectric Multichip ModulesOther: BCircuit Mounting TypeSingle SidedDouble SidedMiltilayerSinglesided Bonded to SubstrateDoublesided Bonded to SubstrateMultilayer Bonded to SubstrateConstrained MultilayerDistributed Plane MultilayerOther: CVia TechnologyNoViasThru Hole ViasBuried ViasBlind ViasThru Hole amp。ETchBPTH Materials and ProcessesAcid Copper PyroPhosphate CopperFull Built ElectroLessGold PasteCopper PasteGold Conductor SputteringNickel Conductor SputteringOther: CPermanent OverplatingTinTinLeadTinNickel AlloyNickelNickel Gold (Hard)Nickel Gold (Soft)Nickel RhodiumConductive PolymerOther: DPermanent Selective PlatingTinTinLeadTinNickel AlloyNickelNickel Gold (Hard)Nickel Gold (Soft)Nickel RhodiumOther: EPermanent Mask or CoatingPhoto Dry FilmPhoto LiquidImage Transfer Screen MaskConformal Coating Solder MaskCover CoatOther: FOther Surface FinishesTinLead FusedImmersion TinSolder LeveledRoll SolderedElectroless Solder FusedSolder Bumped LandsSolder Paste FusedAzole Organic Protective CoveringFlux Protective CoveringOther: Flash gold。D/F224。 Copyright 2004. IPC, Northbrook, Illinois. All rights reserved under both international and PanAmerican copyright conventions.45 / 49FOREWORD It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers work closer to meeting each others needs.ACKNOWLEDGMENTSThe IPC is indebted to the members of the OEM council who participated in the development of this document. A note of thanks is als