【正文】 專利著作權(quán)、商標(biāo)等智慧財產(chǎn)權(quán)之申請準(zhǔn)備 審核會議 C3 目的 檢討樣品測試驗證之結(jié)果、並決定是否進(jìn)入工程試作階段 檢核項目 * HW design verification report * Micro processor/EEPROM data listing * Mechanical test report * SW function verification test report * Mechanical Drawing (Preliminary) * C3 Test Report * C4 Test Plan New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/Utility/Diagnostic release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list C4/PM C4 Meeting Wistron Mobile Reliability Test Plan Environment ? Thermal Profile Test ? Temperature and Humidity Test ? Vibration, Shock, Drop Tests ? Altitude Test, Acoustics Tests ? MTBF Prediction EMC ? Lightning/Surge Test ? Voltage Dip Test ? EFT, ESD Test ? Harmonic Test ? IEC10004XX ? EMI/EMS Power Line Interference ? Line Voltage/Frequency Test ? Power Surge Test ? Voltage Dip and Interruption ? Power On/Off Test ? EFT/B Immunity Test ? Complex Margin Test Transportation ? Vibration Test ? Altitude Test ? Shock Test ? Drop Test User ? Incline Operation Test ? Bench Handling Test ? Power Saving Test ? Pressure Test ? Audio Quality ? Torture Test Reliability Test – LCD Module Wistron Mobile Reliability Test Plan Item Test Condition Sample Size Time Result High Temp / High Humid Op 50℃ 80%RH Dynamin 20 500 Hours Pass Low Temp Op 0℃ , Dynamic 5 500 Hours Pass High Temp Op 60℃ , Dynamic 10 500 Hours Pass High Temp / High Humid storage 60℃ , 90%RH, Storage 2 240 Hours Pass Low Temp storage 20℃ , Storage 2 240 Hours Pass T/C ( NonOp ) 20℃ (30Min) ~ 60℃ (30Min), Storage 3 100cycle Pass Altitude test Operating Storage 2 72 Hours Pass ELP 20℃ , Dynamic 50 72 Hours Pass Vibration(NonOp) 5~500Hz, , , X/Y/Z 3 Pass Shock(NonOp) 180G, 2msec, Half Sine, 177?！? EMC/Safety All products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請產(chǎn)品之安規(guī)、測試、Debug.. QT 為 RD轄下所屬之測試單位人員 ,主要負(fù)責(zé)各項產(chǎn)品之測試 ,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC., CE/Reliability 組件承認(rèn)測試 、 不良品故障分析及其他附件等材料品質(zhì)之管制及保證 產(chǎn)品相關(guān)之可靠度與環(huán)境實(shí)驗 ， 以及可靠度工程之研究與制定 . PCB PCB Layout之申請、 PCB之設(shè)計、 Orcad library Mentor library的建立與管理 . 信號品質(zhì) CAE分析 , PCB layout外包廠商之管理， PCB製造廠商之管理 . OS Certification 執(zhí)行公司各產(chǎn)品之 OS 相容性認(rèn)證測試及 LOGO 申請 . . Beta Site 測試 PDM 料號編碼及控管 ,BOM製作 Wistron Case Role Responsibility Function Responsibility AM (Account Manager) . SAMPLE APPROVAL. . MM (Material Management) is responsible for new supplier development, parts purchasing mechanical tooling status including the schedule, capacity, parts readiness, concerns the dependencies, long leadtime items. also coworks with SQM and CE for ponent quality improvement and the key ponent QVL final version SQM (Supplier Quality Management) * 零件品質(zhì)管理及參與分包商之評鑑 /管理 (SQRC Plan/Status) * 負(fù)責(zé)異常材料分析、追蹤與改善 . * 負(fù)責(zé)進(jìn)行產(chǎn)品 QVL CANDIDATE APPROVAL 作業(yè)系統(tǒng) AT mfg. GCSD . . Field 品質(zhì)改善作業(yè) (EWG) FI 負(fù)責(zé)評估 Project Cost , 決定 Project 是否可行以及 Project 所花費(fèi)之 Cost. Legal 合約及專利審核 Wistron Case Role Responsibility Function Responsibility CFE CFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not NPI 、協(xié)調(diào)、整合與提供 各 Site製造所需相關(guān)資訊與技術(shù)資料 PE/PME , 產(chǎn)品問題之發(fā)覺及產(chǎn)品移交 . ,克服生產(chǎn)瓶頸 ,提高生產(chǎn)力 . ,進(jìn)行改善以確保產(chǎn)品品質(zhì) . IE . 、杜絕不合理，提高生產(chǎn)力 、製程改善、標(biāo)準(zhǔn)工時製定 QA . PCBA,Final Assembly之檢驗標(biāo)準(zhǔn) QE , MTBF, ORT Test (C4) Wistron Case Role Responsibility Func