【正文】 機(jī)………………………………………………………………………………局部基準(zhǔn)標(biāo)志……………………………………………………………………………局部軟釬焊………………………………………………………………………………聚焦紅外再流焊…………………………………………………………………………矩形片狀元件…………………………………………………………………………… L流變調(diào)節(jié)劑………………………………………………………………………………流水線式焊接設(shè)備………………………………………………………………………流水線式貼裝……………………………………………………………………………漏版印刷…………………………………………………………………………………M免清洗焊膏………………………………………………………………………………目視檢驗(yàn)…………………………………………………………………………………P盤式供料器………………………………………………………………………………偏移………………………………………………………………………………………平移偏差…………………………………………………………………………………Q氣相再流焊………………………………………………………………………………群焊………………………………………………………………………………………R熱板再流焊………………………………………………………………………………熱風(fēng)紅外再流焊…………………………………………………………………………熱風(fēng)再流焊………………………………………………………………………………柔性金屬漏版……………………………………………………………………………S散裝式供料器……………………………………………………………………………施膏（膠）檢驗(yàn)…………………………………………………………………………示教式編程………………………………………………………………………………雙波峰焊…………………………………………………………………………………雙蒸汽系統(tǒng)………………………………………………………………………………收縮型小外形封裝………………………………………………………………………順序貼裝…………………………………………………………………………………四邊扁平封裝器件………………………………………………………………………絲網(wǎng)印刷…………………………………………………………………………………絲網(wǎng)印刷機(jī)………………………………………………………………………………塑封有引線芯片載體……………………………………………………………………T塌落………………………………………………………………………………………貼裝………………………………………………………………………………………貼狀方位…………………………………………………………………………………貼裝機(jī)……………………………………………………………………………………貼狀膠……………………………………………………………………………………貼裝檢驗(yàn)…………………………………………………………………………………貼裝精度…………………………………………………………………………………貼裝速度…………………………………………………………………………………貼裝頭……………………………………………………………………………………貼裝壓力…………………………………………………………………………………脫機(jī)編程…………………………………………………………………………………同時(shí)貼裝…………………………………………………………………………………滴涂………………………………………………………………………………………滴涂器…………………………………………………………………………………… W網(wǎng)版………………………………………………………………………………………微型塑封有引線芯片載體…………………………………………………………………無引線陶瓷芯片載體……………………………………………………………………… X細(xì)間距………………………………………………………………………………………3．23細(xì)間距器件…………………………………………………………………………………3．24吸嘴…………………………………………………………………………………………4．31小外形二極管………………………………………………………………………………小外形封裝…………………………………………………………………………………3．4小外形集成電路……………………………………………………………………………3．7小外形晶體管………………………………………………………………………………芯片載體……………………………………………………………………………………芯吸…………………………………………………………………………………………4．77旋轉(zhuǎn)偏差……………………………………………………………………………………4．42翼形引線……………………………………………………………………………………3．19引腳…………………………………………………………………………………………3．18引腳共面性…………………………………………………………………………………3．25引腳間距……………………………………………………………………………………3．22印刷間距……………………………………………………………………………………4．21引線…………………………………………………………………………………………3．17有引線陶瓷芯片載體………………………………………………………………………3．14圓柱形表面組裝……………………………………………………………………………3．3再流焊………………………………………………………………………………………2．4再流氣氛……………………………………………………………………………………4．70在線測(cè)試……………………………………………………………………………………5．6針板轉(zhuǎn)移式滴涂……………………………………………………………………………4．24中速貼裝機(jī)…………………………………………………………………………………4．47注射式滴涂…………………………………………………………………………………4．25自定位………………………………………………………………………………………4．62組裝密度……………………………………………………………………………………2．6附錄A(標(biāo)準(zhǔn)的附錄) 英文索引AAdhesives…………………………………………………………………………………Assembly density………………………………………………………………………… BBatch soldering equipment…………………………………………………………………Beam reflows soldering……………………………………………………………………bulk feeder………………………………………………………………………………… CC—hip quad packs：C—hid carrier………………………………………………………Centering jaw………………………………………………………………………………Centering unit………………………………………………………………………………Chip carrier…………………………………………………………………………………C1eaning after soldering………………………………………………………………………Curing…………………………………………………………………………………………DDispenser………………………………………………………………………………………Dispensing……………………………………………………………………………………..double condensation systems………………………………………………………………….drawbridging…………………………………………………………………………………..drying。5．11返修工作臺(tái)rework station 能對(duì)有質(zhì)量缺陷的組裝板進(jìn)行返修的專用設(shè)備或系統(tǒng)，5．12基準(zhǔn)標(biāo)志fiducial mark 在印制板照相底版或印制板上，為制造印制板或進(jìn)行表面組裝各工序，提供精密定位所設(shè)置的特定的幾何圖形。它是散布在焊點(diǎn)附近的微小珠狀焊料。5．8 工藝焊盤dummy land 為減小表面組裝元器件貼裝后的架空高度，設(shè)置在印制板涂膠位置上的有阻焊膜的空焊盤。5．7 表面組裝焊點(diǎn)surface mounted solder joints組裝板上表面組裝元器件焊端或引腳與印制板焊盤之間實(shí)現(xiàn)軟釬焊連接所形成的連接區(qū)域。5．5 機(jī)視檢驗(yàn)machine inspection 泛指所有利用檢測(cè)設(shè)備進(jìn)行組裝板質(zhì)量檢驗(yàn)的方法。5．3 焊后檢驗(yàn)inspection after soldering 印制板完成焊接后的質(zhì)量檢驗(yàn)。5. 檢驗(yàn)及其他術(shù)語5. 1 貼裝檢驗(yàn) placement inspection表面組裝元器件貼裝時(shí)或完成后，對(duì)于有否漏貼、錯(cuò)位、貼錯(cuò)、元器件損壞等情況進(jìn)行的質(zhì)量檢驗(yàn)。4．83焊后清洗cleaning after soldering 印制板完成焊接后，用溶劑、水或其蒸氣進(jìn)行清洗，以去除焊劑殘留物和其他污染物的工藝過程。4．80紅外再流焊機(jī)IR reflow soldering system 可實(shí)現(xiàn)紅外再流焊功能的焊接設(shè)備， 同義詞 紅外爐IR oven4．81群焊mass soldering 對(duì)印制板上所有的待焊點(diǎn)同時(shí)加熱進(jìn)行軟釬焊的方法。 同義詞 上吸錫；燈芯現(xiàn)象4．78間歇式焊接設(shè)備batch soldering equipment 可使貼好