【正文】 16 / 16。本標準由電子工業(yè)部工藝研究所負責起草。 mounter………………………..Placement head…………………………………………………………………………………Placement inspection……………………………………………………………………………Placement pressure………………………………………………………………………………Placement speed…………………………………………………………………………………Plastic leaded chip carriers(PLCC)……………………………………………………………..Precise placement equipment…………………………………………………………………… uad flat pack(QFP)……………………………………………………………………………. RRectangular chip ponent…………………………………………………………………….Reflow atmosphere……………………………………………………………………………...Reflow soldering…………………………………………………………………………………Resolution……………………………………………………………………………………….Repeatability…………………………………………………………………………………….Rework rtation…………………………………………………………………………………Reworking……………………………………………………………………………………..Rheologic modifiers……………………………………………………………………………Rotating deviation……………………………………………………………………………… SScreen, printer………………………………………………………………………………….Screen printing………………………………………………………………………………….Screen printing plate……………………………………………………………………………Self alignment…………………………………………………………………………………..Sequential placement……………………………………………………………………………Shifting deviation………………………………………………………………………………..Shrink small outline package(SSOP)……………………………………………………………Simultaneous placement………………………………………………………………………...Single condensation systems……………………………………………………………………Skewing………………………………………………………………………………………….Slump……………………………………………………………………………………………Small outline diode(SOD)……………………………………………………………………….Small outline integrated circuit (SOIC)………………………………………………………….Small outline package (SOP)…………………………………………………………………….Small outline transistor (SOT)……………………………………………………………………Snapoffdistance………………………………………………………………………………..Solder balls………………………………………………………………………………………Solder paste。 pickplace equipment。 cylindrical…………………………………………Metal stencil。 infrared, reflow soldering…………………………………………………IR shadowing…………………………………………………………………………………… JJlead…………………………………………………………………………………………….LLocated soldering………………………………………………………………………………..Laster reflow soldering………………………………………………………………………….Lesd …………………………………………………………………………………………….Lead coplanarity…………………………………………………………………………………Lead foot。附錄A(標準的附錄) 漢語索引 B表面組裝焊點…………………………………………………………………………….表面組裝技術…………………………………………………………………………….表面組裝元器件………………………………………………………………………….表面組裝組件…………………………………………………………………………….波峰焊……………………………………………………………………………………. CC形四邊封裝器件……………………………………………………………………….重復性…………………………………………………………………………………….觸變性……………………………………………………………………………………. D帶式供料器……………………………………………………………………………….帶狀封裝………………………………………………………………………………….單蒸氣系統(tǒng)……………………………………………………………………………….低速貼裝機……………………………………………………………………………….低溫焊膏………………………………………………………………………………….吊橋……………………………………………………………………………………….定心臺…………………………………………………………………………………….定心爪…………………………………………………………………………………….F返修……………………………………………………………………………………….返修工作臺……………………………………………………………………………….飛片……………………………………………………………………………………….飛辨率…………………………………………………………………………………….G桿式供料器……………………………………………………………………………….干燥……………………………………………………………………………………….高速貼裝機………………………………………………………………………………膏狀焊料…………………………………………………………………………………供料器……………………………………………………………………………………供料器架…………………………………………………………………………………工藝焊盤…………………………………………………………………………………固化………………………………………………………………………………………刮板………………………………………………………………………………………掛珠………………………………………………………………………………………光學再流焊………………………………………………………………………………光學校準系統(tǒng) H焊端………………………………………………………………………………………焊膏分層…………………………………………………………………………………焊膏工作壽命……………………………………………………………………………焊膏貯存壽命……………………………………………………………………………焊后檢驗…………………………………………………………………………………焊后清洗…………………………………………………………………………………焊劑氣泡…………………………………………………………………………………焊料粉末…………………………………………………………………………………焊料球……………………………………………………………………………………焊料遮蔽…………………………………………………………………………………紅外再流焊………………………………………………………………………………紅外再流焊機……………………………………………………………………………紅外遮蔽………………………………………………………………………………… II形引線………………………………………………………………………………… JJ形引線…………………………………………………………………………………激光再流焊………………………………………………………………………………機視檢驗…………………………………………………………………………………基準標志…………………………………………………………………………………間歇式焊接設備…………………………………………………………………………金屬（粉末）百分含量…………………………………………………………………金屬漏版…………………………………………………………………………………精密貼裝