【正文】 具 來自生產(chǎn)和維修工具模具的經(jīng)濟損失 開機啟動損失 過載損失 溫度損失 阻礙設(shè)備效率的8大損失 阻礙 人的效率的5大損失 EQUIPMENT 設(shè)備的 8種主要損失和 OEE的關(guān)系 Relationship between 8 Major Losses on Equipment and Overall Equipment Efficiency. 8 MAJOR LOSSES CALCULATION OF OVERALL EQUIPMENT EFFICIENCY x 100 Loading time downtime Availability = Loading time x 100 460 mins60 mins Availability = 460 mins (Example) = 87% Operating time (Example) Performance = Standard cycle time x Product units processed Performance rate x 100 mins/units x 400 units 400 mins x 100 = 50% rate = Product units processed defect units = (yld) Quality products rate Product units processed x 100 400 units 8 units 400 units x 100 (Example) = 98% Quality products rate 實際運行時間 性能損失 Perf. Loss 有價值的 運行時間 質(zhì)量缺 陷損失 Defect Loss 負荷工時 運行時間 停止損失 D/Time Loss 總工時 1)故障損失 Equipment Failure 2)作業(yè)準備損失 Setup amp。 Unit is pushed off the NG Form floater after trim Etc…. 1 2 3 4 5 ? 理解設(shè)備 /工藝的運行功能和原理 Understand operating functions and principles of the equipment / process 進行設(shè)備 /工藝的一步一步功能排序的圖 perform stepbystep functional sequencing mapping of the equipment / process 進行設(shè)備、工藝的詳細流程地圖 perform detailed process mapping of the equipment / process 1 Step 6 of CI Approach Root Cause Analysis 根本原因的分析 2 3 4 5 6 Press Index button Send signal to CPU Energizes Zmotor Motor turns clockwise Turns belt clockwise Turns lead screw Slider assy moves up 在分配器 A的運送系統(tǒng)中的流程地圖 PROCESS MAPPING OF FEEDSYSTEM AT DISPENSER A (SMB) S1 S2 SD S3 M1 C1 C2 D1 MAGAZINE LEGEND : S1, S2, S3 : LEAD FRAME PRESENCE SENSOR框架現(xiàn)場傳感器 SD : LEAD FRAME INDEXING SENSOR FOR SOLDER DISPENSE POSITION用于焊接位置的框架步進傳感器 C1 , C2 : CLAMPER FOR CLAMPING FRAME TO CONVEYER BELT FOR POSITIVE FORWARD M1 : TRACK MOTOR TO DRIVE THE CONVERYER BELT驅(qū)動運送皮帶的馬達 B1 : CONVEYER BELT運送裝置皮帶 D1 : DISPENSE LOWER B1 PLAN VIEW OF SOLDER DISPENSE SECTION OF ALPHA7 DEFINITION OF JAM AT DISPENSE在分配器上的阻塞定義 在下列條件下，機器在分配器將會發(fā)生阻塞： THE M/C WILL RESIGTER A JAM AT DISPENSE AS BELOW CONDITION: 1. S2處于 ON時，框架輸入， C1和 M1被觸發(fā)，約 5秒后，框架到達 SD處。 Form Manual Index Out to Tube Note : Genba starts here till Step 8. 1 2 3 4 用 5種發(fā)生器來收集數(shù)據(jù) Use Five Gens For Data Collection Go to the shop floor, observe actual conditions, collect/verify data and confirm Losses. Do not depend on secondsource data. Japanese Definition Genba OnSite Genbutsu Actual Object Gensho Phenomenon Genri Theory Gensoku Rules amp。 jig change loss (8) Shut down (SD) loss (13) Measurement amp。 methodologies ? 協(xié)同運作 AM / PM/ QM 支柱 Collaboration with AM/ PM/ QM Pillar ? 提供 WhyWhy和 PM分析的培訓 Provide Training on WhyWhy and PM Analysis ? 回顧項目的進展 Review project progress ? 回顧影響到具體的數(shù)據(jù) Review impact to metrics APS損失 APS losses CI項目 CI projects 工廠標準化體系 Plant metrics APS TPM TRAINING PROCESS 心臟 Heart Feelings/ Passion (Values Training) 手 Hands (AM Workshop) 腿 Legs (Cascading Small Group Activity) 腦 Brain (Burning Platform) Understand the Business World Understanding why past success carry the seed of Failure 心 Mind (Introduction to TPM ) Understanding TPM Collaboration for a Common Goal ! E .H. S. Continuous Improvement Autonomous Maintenance Planned Maintenance Training amp。 Adjustment 3)工具交換損失 Component Change 4)開機啟動損失 Startup Losses 5)空轉(zhuǎn)或者空閑損失 Minor Stoppages 6)速度低下?lián)p失 Speed Losses 7)質(zhì)量缺陷和返工損失 Defects / Reworks A) Planned Shutdown 計劃停機 B) Breaktime 中斷時間 C) Planned PM 計劃 PM 計劃 停機 Schld. D/Time Overall Equipment Efficiency = Availability x Performance Rate x Quality Products Rate (Example) x x x 100 = % 8）停機損失 = 導致設(shè)備失效的 5種因數(shù)的組合 Combination of 5 Factors leading to Equipment Failure 不適當?shù)某跏紬l件 /狀態(tài) Inadequate original conditions 技能匱乏 Lack of skills 設(shè)計缺陷 Design shortings 不遵守運行條件 Nonobservance of operating conditions 遺留的未 修理的變質(zhì) Leaving deterioration unrepaired 9步 CI路徑 The 9Steps CI Approach 1 2 3 4 5 6 7 8 9 Theme / Reason For Selection選擇的理由 /主題 Understanding Current Situation理解當前的狀態(tài) Goal Setting amp。 DURING LD FRAME INPUT WHEN S2 IS ON ,C1 AND M1 IS TRIGGER, AND THE FRAME FAIL TO REACH THE SD POSITION IN ABOUT 5 SEC. 2. 當框架到達下一步位置時，在每一個分配步進的序列處 AT EACH DISPENSE INDEXING SEQUENCE WHEN THE FRAME FAIL TO INDEX TO NEXT INDEX POSITION. NOTE: Include dimensions amp。 Process Flow設(shè)備和工藝的輪廓 ? List the Equipment and / or Process Flow of the likely operations that may give rise to the /或工藝流程 Eg1: Lifted bonds Types 1 to 4 (refer to eg1 in Step 2) defect Pareto modes Auto Index In PR Recognition Bond Auto Index Out Lifted wire Type 5 defect Ining Wfr Saw Die bond Auto Index In PR Bond Index Out Eg2: Bent Lead Manual Index In Trim amp。 adjustment loss (10) Operating motion loss (12) Logistic loss (3) Cutting blade amp。 Education Initial Flow Control Quality Maintenance Office TPM TPM 8 PILLAR 完整的 5S管理新行動 基石 CI的范圍 SCOPE OF . . Tamp。 Plan目標的設(shè)定和計劃 Outline Of Equipment amp。 tolerances! OPERATING SEQUENCE FOR LD FRAME INPUT TILL DISPENSE PROCESS. (SMB) 1. LEAD FRAME IS PUSHED INTO TRACK FRO