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機械專業(yè)文獻翻譯--微型模具成型的熱量和擠壓控制(留存版)

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【正文】 re extrusion mechanism is driven by a piezo element to apply force on important area with microstructures. For example, after injection it increases the cavity pressure from 20 to 34 MPa. Small sensors consist of the pressure, displacement, and heat flux sensor assemblies,arranged around the small cavity. The signals showed us the physical phenomena inside the mold and may be further used as control signal. In order to evaluate this injection press molding system, we formed micro triangular grooves of pitch 1 lm and angle 140o. The moldcore extrusion gave better diffraction intensity by several percents. 1 Introduction Many information and medical equipment contain functional parts with microstructures in the order of 1 lm and overall size of several millimeters. Molding is a mass production method widely used in duplicating three dimensional forms of these parts [1–4]. This paper reports our study on one of the molding processes, namely, the injection press molding process. In contrast to regular injection molding process that injects molten resin at high pressure into the cavity for simultaneous filling and forming, injection press molding process separates the time of the two processes. Injection press molding process injects molten resin into a mold cavity at low pressure to keep the flow resistance small,and once the cavity is filled, applies large clamping force on molds to form microstructures. Injection press molding has superb transforming capability used for example, in forming optical disks and LCD light guiding plates. Conventional injection press molding applies large clamping force on molds for forming after the filling process. However, conventional injection press molding process has two problems for forming 機械專業(yè)中英文文獻翻譯 micro parts described above. First, in forming multiple micro parts with a single set of molds, the temperature and rigidity distributions are not uniform causing difference in forming pressure [5, 6]. Generally, the temperature is higher around the mold center and the pressing force is higher around the perimeter. Secondly, even if one tries to flatten the uneven distribution with cooling or pressure control, sensors to monitor the heat flux or pressure are larger than the micro parts and cannot find these conditions within the that measuring heat flux instead of temperature allows monitoring resin solidification in the cavity. The authors of this paper dev
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