x蘇州電子公司-單面板設(shè)計(jì)與制程能力規(guī)范-文庫(kù)吧在線(xiàn)文庫(kù)
【正文】 六 剝離強(qiáng)度試驗(yàn) PEEL STRENGTH TEST 3M TAPE50㎜ 測(cè)試後碳墨不得剝離 NO PEELOFF CARBON IS PERMITTED 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 22 試驗(yàn)項(xiàng)目 TEST ITEM 試驗(yàn)條件 TEST CONDITION 規(guī) 格 SPECIFICATION 七 彎曲試驗(yàn) BENDING TEST BENDING 3㎜10times 測(cè)試後電阻值變化率小於 50% VARIATION OF RESISTANCE LESS THAN 50% 八 落下試驗(yàn) DROP TEST CONCRETE FLOOR 1MH.10 TIMES 測(cè)試後電阻值變化率小於 50% VARIATION OF RESISTANCE LESS THAN 50% 九 耐溶劑試驗(yàn) ANTISOLVENT TEST ACETONE10mins 測(cè)試後電阻值變化率小於 50% VARIATION OF RESISTANCE LESS THAN 50% 十 碳墨耐撞擊壽命 CARBON TOUCH LIFE TEST (450＋ 50) g/㎝ 22hits/sec1500000 hits 測(cè)試後電阻值變化率小於 50% VARIATION OF RESISTANCE LESS THAN 50% 、電器特性 ELECTRICAL PROPERTIES 名 稱(chēng) (NAME) 規(guī) 格 SPECIFICATION 電阻值 RESISTANCE 45Ω /□ 絕緣電阻值 INSULATION RESISTANCE ＞ 100 MΩ (DC 40V) 額定電壓 RATED VOLTAGE UNDER(DC 12V) 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 23 、碳墨印刷試驗(yàn)項(xiàng)目與方法 SPECIFICATION OF TESTING METHODS AND ITEMS FOR PCB WITH CARBON PRINTING 耐溼度特性試驗(yàn) (HUMIDITY RESIST TEST) PRIOR TO RESISTANCE TESTING， THE SPECIMEN SHALL BE PROCESSED AS FOLLOWING PROCEDURE. 1)(60177。15) MINS. VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LESS THAN 177。 50％ 預(yù)熱迴流試驗(yàn) (RESISTANCE VARIANCE AGAINST HEAT REFLOW TEST) PRIOR TO RESISTANCE TESTING， THE SPECIMEN SHALL BE PROCESSED AS FOLLOWING PROCEDURE. 1)AS SHOWN IN THE FOLLOWING FIGURE， THE TEMP. STARTS AT ROOM TEMP.， RISES TO (150177。50 g / cm2 4) FREQUENCY ： 2 HITS / SEC. 5) TOTAL TIMES ： 1,500,000 HITS. VARIANCE OF RESISTANCE AFTER TESTING MUST BE LESS THAN 177。 50％ 落下試驗(yàn) (RESISTANCE VARIANCE ON DROP TEST) PRIOR TO RESISTANCE TESTING， LET THE PCB VERTICALLY DROP， FROM A HEIGHT OF 1 MM， ONTO THE FLOOR， FOR 10 TIMES VARIANCE OF RESISTANCE ON DROP MUST BE LESS THAN 177。 15) MINS. VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LESS THAN 177。15) MINS. 3) ROOM TEMP. 30 MINS. VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LESS THAN 177。12) hrs 測(cè)試後電阻值變化率小於 50% VARIATION OF RESISTANCE LESS THAN 50% 三 耐冷熱循環(huán)特性實(shí)驗(yàn) HEAT CYCLING TEST {(40℃ 30 mins)＋(100℃177。 ㎜ VCUT 方向與板邊應(yīng)平行 。 VCUT 溝槽寬度 (THE WIDTH OF VCUT SCORE LINE) 角度 30176。 DIMENSIONAL PRECISION：177。０．２ ０．２㎜ 177。 F R4 177。 CEM1 177。、４５176。 CHIPOFF： Max 50％ OF THE THICKNESS。 TOLERANCE TO THE HOLE LOCATION OF FIDUCIAL MARK 177。 圓孔最小孔徑（㎜） MIN HOLE DIAMETER（㎜） 厚度 THICKNESS FR1／ FR2 ＣＥＭ－１ ＣＥＭ－３ ＦＲ－４ ０．８㎜ ０．６０ ０．６０ ０．７０ ０．８０ １．０㎜ ０．６０ ０．７０ ０．７５ ０．８０ １．２㎜ ０．６５ ０．７５ ０．８０ ＮＣ １．６㎜ ０．６５ ０．８０ ０．９０ ＮＣ ２．０㎜ ０．９０ １．００ １．１０ ＮＣ 方形孔最小尺寸（㎜） MIN SIZE OF THE SLOT 材 質(zhì) MAT‘L 紙 板 FR FR2 CEM1 CEM3 尺寸 SIZE ０．７１．５㎜ ０．８１．５㎜ ０．９１．５㎜ 孔徑公差（㎜） TOLERANCE OF NORMAL HOLE 一般孔 TOLERANCE OF NORMAL HOLE DIAMETER（㎜） 敬鵬 (蘇州 )電子有限公司 ACP. ELECTRONICS CO., LTD. F:\EN\002 8 項(xiàng) 目 ITEM 一 般 孔 之 孔 徑 公 差 TOLERANCE OF HOLE DIAMETER 圓孔 HOLE 177。 ︰ ０．０２５μｍ（１μ inch）～０．５００μｍ（２０μ inch） 。 顏色：黑色、白色、藍(lán)色、綠色 。 SOLDER RESIST 防焊圈大於 PAD 之最小距離（㎜） CLEARANCE TO CONDUCTOR（㎜） 銅箔厚度 THE THICKNESS OF COPPER UV 防焊 UV SOLDER RESIST IR 防焊 IR SOLDER RESIST ３５ μｍ Ｍｉｎ ０．１５㎜ Ｍｉｎ ０．２０㎜ ７０ μｍ Ｍｉｎ ０．２５㎜ Ｍｉｎ ０．３０㎜ ２、防焊印刷 D A w L S
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