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solder holes are very few (1000 dppm).(2) + 錫橋及錫孔不多(1000 dppm). C8 Component sequencing and segregation (manual insertion) 零件的次序及隔離(手插零件)NA Operation not applicable 此作業(yè)不適用.0 Similar ponents (shape, size, color) are not well sequenced and segregated to avoid material mix up or misuse.相似零件(形狀,大小,顏色)未能作有效排及分開放置,避免導致零件混淆或誤用. 1 Good ponent sequencing and segregation to avoid similar ponent mix up. For PCBA production, critical ponent such as jacks, push button should be sequenced to be after wave soldering if it is foam fluxed process.能有效排序和分離零件以避免混淆,若使用泡沫松香的PCBA生產(chǎn)制程,重要部品如插座,按鈕開關等部件均需排列在波峰制程進行後焊.2 (1) + History card or similar practice in place amp。 CA by manufacturer is well followed up and recorded.(2) + 有效地跟進并記錄供應商圍堵及改善行動的執(zhí)行情況. Disposition of rejected lots 拒收的處理0 Return to Vendor is the program, with awareness and approval by single party (usually QA).在單一部門(通常為QA)知會及批準的情況下便將物料退回供應商.1 Formal Material Review Board (MRB) or similar system in place to deal with rejected material disposition, including “scrap”, “rework”, “RTV”, “UAI”, etc.有正式的物料檢討系統(tǒng)(如MRB),處理拒收物料,包括“報廢”, “返工”, “退貨”, “可用”等等.2 (1) + Relevant procedure is well documented + add working instruction if necessary. (1) + 相關程序有文件証明 + 如需要加上作業(yè)指導.3 (2) + Every rejected lot is properly handled with no exception.(2) + 對所有拒收材都毫無例外地按序合理處理. B2 Inprocess inspection and monitoring (IPQC) 制程的檢驗和監(jiān)督. Inprocess Control Instructions 製程控制指引NA Operation not applicable. 此作業(yè)不適用.0 No special documented guidelines for inprocess control, random checking.沒有文件指引對制程的控制,只作隨機性的抽檢.1 Critical processes or areas are well addressed and identified for IPQC inspection and monitoring.重要制程或工位均有明確指出予IPQC作檢查及監(jiān)察.2 (1) + All sampling requirements (sample frequency, quantity, checking parameters, etc.) well specified and documented.(1) + 所有抽樣要求(抽樣頻率,數(shù)量,檢驗項目及參數(shù)等)都有詳細說明和有文件証明.3 (2) + Process management plan (PMP) in place, with controls (charts or checklist).(2) + 制程管理計劃清楚界定各重要制程及Manufacturer Approval Procedure 供稱商認可程序(For SQE application ??刂?圖表或核查單). Inprocess Control Records 製程控制紀錄NA Operation not applicable. 此作業(yè)不適用.0 No checklist, or informal record (raw data) only. 沒有核查單或只有非正式紀錄.1 Formal record in place which indicates relevant process name, machine number, inspector name, time interval, inspected items, judgment, etc.正規(guī)紀錄清楚註明相關工序之名稱,機器號碼,檢查員名字,時段,檢驗項目,判定等.2 (1) + Checklist format is well followed and used with no exception. Sampling plan and activities are well set and implemented respectively.(1) + 毫無例外地跟按核查單執(zhí)行,建立良好的抽樣計劃及實施相關活動.3 (2) + Inspection records are well filed and kept with good traceability.(2) + 檢驗紀錄能有效存檔保持良好之可追溯性. CAR system for continuous improvement 改善行動要求(CAR)系統(tǒng)以達至連續(xù)改善NA Operation not applicable. 此作業(yè)不適用.0 Record not plete or no feedback of inprocess defect situation.生產(chǎn)中的缺陷點紀錄不存或沒有反饋.1 Nonconforming material report (NCMR) / internal corrective action request (ICAR) system in place to feedback inprocess defect situation.物料異常報告/內部改善行動要求書(NCMR/ ICAR)體系適當?shù)胤答伾a(chǎn)中的缺陷點.2 (1) + Issued reports are well replied by responsible departments on time and appropriately. Relevant action items are well followed for effectiveness.(1) + 有關部門準時適當?shù)鼗貜蛨蟾鎭K能有效地跟進相關改善行動的有效性. 3 (2) + Documented “stop line” criteria in place whenever defect rate exceeds set target.(2) + “停線”作業(yè)指引文件,指定線上壞品率超出指定目標情況下需執(zhí)行“停線”要求. First piece approval for mass production 大量生產(chǎn)前之首件批核.0 No such procedure at all.沒有此程序.1 First article approval procedure is well performed for defined critical processes.各重要制程之生產(chǎn)樣品批核程序較好地執(zhí)行良好.2 (1) + Procedure well documented and records well maintained.(1) + 程序有明文規(guī)定及保存紀錄良好.3 (2) + Approval samples are well identified, maintained and displayed in the place of use.(2) + 有關批核樣品作清楚標識,維護及使用於工位中. Functional verification amp。 well managed(1) + 使用品質紀錄咭或相似方法, 且管理完善.3 (2) + A lot of evidence showing continuous improvement.(2) + 大量証據(jù)顯示連續(xù)改善. C9 Component preforming 零件預加工成形NA Process not applicable 制程/工序不適用.0 Making use of trimming process. Majority of ponents are not preformed before manual and automatic assembly (MI and AI)採用剪腳工序, 或大部份零件在人手/自動插件前都未進行預加工成形.1 Majority of ponents undergo preforming to correct lead shape and length to avoid extra lead trimming process or soldering process.大部份零件都經(jīng)過預加工成形,調整各零件腳形狀和長度之要求,並省卻額外對零件腳切斷及焊錫制程之要求.2 (1) + Preforming operation requirement is included in process management plan (PMP).(1) + 預加工成形的作業(yè)要求包括在制程管理計劃(PMP)中.3 (2) + Preforming stations are well managed.(2) + 此步驟得到很好的管理. C10 Parts change verification and approval (SMT and AI process) 對更換部件的檢驗和認可NA Operation not applicable 此作業(yè)不適用.0 No checking or simple checking without record.沒有檢驗或簡單檢驗,沒做紀錄..1 After each parts change, relevant ponent batches are checked and confirmed to be correct with proper record for ponent details, date and time of change, responsible person.部件更換后,由負責人員即時進行檢驗及確認相關部件是否正確,并有效記錄部件明細,更換日期及負責人等資料.2 (1) + Parts change verification requirement is well documented as working instruction.(1) + 對更換零件之確認要求於作業(yè)指導書中清楚列明.3 (2) + Evidence showing the system is effective without exception.(2) + 有証據(jù)表明系統(tǒng)之有效性,無一例外. C11 Solder contamination analysis 焊錫污染度分析NA Process not applicable 制程/工序不適用.0 No conducting of such analysis.沒有進行此類分析. 1 Analysis is conducted informally and irregularly, usually upon customer request.分析工作以非正式及非定期方式執(zhí)行,通常是基于客戶要求.2 Analysis is conducted in periodic basis (say 3 months to half year) with proper management and filing of analysis reports.分析工作以周期性(一般為3個月到半年),并將分析報告作正確及有效存檔.3 (2) + Easy tracing by graphical presentation. (2) + 以圖示方便追蹤. C12 Approved sample retention in workstations 工作崗位保留批核樣品NA Operation not applicable 此作業(yè)不適用.0 No approved or authorized signature on reference samples or samples not well identified.參考樣品沒有經(jīng)過批核,或已核準但沒有負責人簽署認可,或對參考樣