【正文】 D1D2D3D4D5Stitch Stud Bump (SSB) Shear, Measure 10 balls 60um =71um Pad Opening, Minimum 2 Strips (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Stitch Stud Bump (SSB) Shear, Measure 10 balls 52um =60um Pad Opening, Minimum 2 Strips (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Ball Shear on substrate, Measure 10 balls 52um =60um Pad Opening, Minimum 2 Strips (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg BSSWedge Bond Shear (if applicable), Measure 10 balls 65um =80um Pad Opening, Minimum 10 units (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Plasma or UV (Use if Applicable)Make and Model numberPowerTimeGas MixtureLid Attach Bstage or Solder (if applicable)Make and Model numberCure TimeCure Temperature amp。 hardness/metal) and AngleBlade ForceBlade SpeedSeparation speed amp。CReflow profile nameNitrogen oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMFlux Printing (for Flip Chip – use if applicable)Attach sample picture for each die.Flux Stencil Parameters:Stencil ThicknessStencil MaterialAperture Opening Design – (Special design and % of solder mask or metal opening)Flux Print Process Parameters:Blade type (plastic amp。 Purpose目的This document provides templates for recording package qualification data for RFMD product and instructions for plying with Materials Declaration.提供記錄RFMD產(chǎn)品考核認(rèn)證所需信息資料的模板,及遵從物質(zhì)申明的說(shuō)明 Scope范圍Apply to RFMD package qualification適用于RFMD考核認(rèn)證產(chǎn)品 Instruction說(shuō)明 Materials Declaration: The Subcontractor Assembly house is required to submit Materials Declaration forms listing the required banned, banned with acceptable threshold level, reportable or other materials required by RFMD QAL211028 for assemblies manufactured for RFMD. These are required for current and new assemblies and must be updated whenever material changes occur or whenever a new substrate process development or assembly qualification begins. The supplier will be required to provide proof of pliancy with a chemical analysis. See QAL211028 for details on requirements, reporting structure, and reporting format.物質(zhì)申明: 外包封裝廠需要提交物質(zhì)聲明書(shū)，列明禁用材料，禁用但可接受門(mén)限的材料、需告知的或其他由RFMD QAL211028文件規(guī)定的用于RFMD封裝制造產(chǎn)品的材料. 這些規(guī)定適用于現(xiàn)有及未來(lái)新的封裝產(chǎn)品,當(dāng)材料變更,新基板工藝流程的開(kāi)發(fā)或開(kāi)始封裝考核認(rèn)證時(shí)都要提交該聲明書(shū). 供應(yīng)商還需要提供化學(xué)分析作為依據(jù). 參考QAL211028文件中的詳細(xì)要求,報(bào)告的結(jié)構(gòu)和格式。CTime above 150176。 opening X,Y distance(s)Paste Print Process Parameters:Blade type (plastic amp。CReflow profile nameNitrogen Oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMAttach MethodParametersNeedle (per die) actual PSI:PSI Setting: PSI Actual:Transfer Time (time from PS to PE):Sec:**Mold Temperature setting amp。C Setting:186。注意top cull的設(shè)定特性參數(shù)為正數(shù)還是負(fù)數(shù)。預(yù)熱時(shí)間是從料餅放入套筒中到頂桿開(kāi)始移動(dòng)的時(shí)間。 Form (Use if Applicable)Make and Model numberStroke per/minPackage Tip to Tip, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg TTPackage Standoff, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg PSPackage Coplanarity, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg CLead Integrity, (repeat for lot 2 and 3)Pass/fail End of Line Inspection and Yield ReportSMT (If Applicable)Defect Breakdown Qty in Qty out Yield Die Attach Defect Breakdown Qty in Qty out Yield Flip Chip Atach Defect Breakdown Qty in Qty out Yield Wire Bond Defect Breakdown Qty in Qty out Yield 3rd Optical Defect Breakdown Qty in Qty out Yield Mold Defect Breakdown Qty in Qty out Yield Lid Attach Defect Breakdown Qty in Qty out Yield Gross amp。Perform silicon die bond pad crack inspection post wirebond for 10 pads / lot. Attach 1 worst case picture per lot.每批產(chǎn)品球焊完成后檢驗(yàn)硅片的10個(gè)pad的彈坑，并附pad受損最嚴(yán)重的照片Supply 1 open faced strip per lot as require in the purchase order按客戶(hù)訂單要求每批產(chǎn)品中提供一條未塑封的產(chǎn)品Comprehensive Yield Report綜合的良率報(bào)告改善計(jì)劃/Corrective Action Plan for top 5 Rejects1.2.3.4.5.24 / 2