led產(chǎn)業(yè)發(fā)展趨勢(shì)概述-全文預(yù)覽
【正文】 type substrate N layer P layer Nside electrode Pside electrode LED Chip structure LED structure Cathode Lead Flat Spot Anode Lead Lead Frame Wire Bond Epoxy Lens Semiconductor Chip Epoxy Case Reflective Cup LED元件結(jié)構(gòu) 考慮不同的應(yīng)用需求，及 LED本身的出光光型、發(fā)光角度等，因而發(fā)展出不同的封裝型態(tài) Lamp LED Piranha LED SMD LED – Top View SMD LED – Side View High Power LED LED封裝型式 SMD Lamp Lead frame 固晶 銲線 灌膠 電鍍 切半斷 外觀 切全斷 測(cè)試 包裝 檢驗(yàn) LED封裝製程 LAMP 固晶 銲線 壓模 長(zhǎng)烤 切割 烘烤 外觀 測(cè)試 包裝 檢驗(yàn) SMD LED Chip Phosphor White Light Generation CRI 演色性指數(shù) Single Chip Blue LED InGaN + YAG Blue light + Yellow phosphor 6075% UV LED InGaN + RGB phosphor UV + RGB phosphors 90% up Blue LED InGaN + R、 G phosphor Blue + RG phosphors 90% Multi Chip RGB multichip LED AlInGaP + InGaN + AlGaAs RGB pensation 80% up LED白光製作方式 Chip Ability Phosphor Efficiency Encapsulation Refractive Index Reflective Material Reflectance Package Design EX : Different Current Spreading EX : Different Particle Size RI= ? RI= LED效率改善因子 Sulfidizing Gas Crack Delamination Failed or Over 5% brightness decay Ag frame color changes (over 5% brightness decay) Failed or Over 5% brightness decay PPA PPA color changes (over 5% brightness decay) LED信賴性改善因子 RI Hardness A 50 A 70 A 55 D 35 D 75 H20 (g/m2/24h) 100 80 50 20 2 O2 (cm3/m2/24h/atm) 36000 22023 5500 900 130 Sulfur test Test package : 50215 (3014) Sulfur Water prevention How to prevent sulfur moisture peration Silicone with higher hardness higher refractive index can prevent moisture sulfur p
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