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counterfeitpartsadvisory仿冒電子元件公告-全文預(yù)覽

2025-07-14 13:52 上一頁面

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【正文】 his batch of parts on a reel had the markings in a little different area on each part. This particular one missed the part on the left hand side. 廠商認(rèn)為,IC芯片標(biāo)志必須位于芯片某個恰當(dāng)?shù)奈恢?。Imperfections仿冒缺陷All of the manufactures, which we have spoken to, state that they have high quality standards which preclude them from major imperfections. The part numbers are to be in a certain location on the part and they are not to be crooked, misspelled, or out of alignment. The logos are also monitored very closely and should not vary from part to part. In addition, the markings are to withstand tough environments and still be legible. 與我們溝通過的那些廠商聲稱,他們對IC芯片有著高質(zhì)量的標(biāo)準(zhǔn)要求,完全可以排除出現(xiàn)主要缺陷的可能性。BEFOREThis is a before picture of a part we suspected of being counterfeit. See the textured, but shiny black finish? 用丙酮清洗前左圖為用丙酮清洗前的IC芯片。我們明白這種情況比較罕見,但是事實(shí)上卻發(fā)生了。我們將此問題反饋給我們的供應(yīng)商。于是,我們決定將這一層“瀝青”刮下來,結(jié)果發(fā)現(xiàn)“Cypress”標(biāo)志下面竟然有個“Altera”商標(biāo)。This is one of our most amazing discoveries. This very shiny, smooth, but orange peel type finish was not natural looking. You need to start to be able to tell an authentic texture from a fake. This one made it a bit easier because it was so different. We decided to try to scrape the thick looking blacktop off and we found this Altera logo under the Cypress marking. 右圖為我們迄今為止所獲得的最為驚人發(fā)現(xiàn)中的一個。On the top left hand side of this part the sander went a little too far. You can see that they have made an angle sloping downwards which none of the other parts in this lot had. This is unmon, although it is mon to see an edge slightly rounded. You can see this when looking through the microscope, but it is hard to show in a 2 dimensional photograph. 從左圖里IC芯片的正面左邊位置可以看出,仿冒者似乎砂磨得有些過頭了。On the above 2 pictures I want to focus on the directional sanding marks. Parts ing straight out of a mold will not have any marks the have a directional pattern. These types of marks are made when the counterfeiters are sanding off the top or bottom markings to prepare the part for blacktopping. Again, you must have a microscope to see this type of inconsistency. It is not visible with the human eye. 關(guān)于以上2張圖片,在此我們要強(qiáng)調(diào)的是定向砂磨標(biāo)記。這些IC芯片是同一個模子出來的,而這些模具的開發(fā)也不是為了使表面色澤明亮而達(dá)到良好的視覺效果。其實(shí),仿冒者在制造這個圓圈時,所犯的錯誤是顯而易見的。The more samples you see you should start to be able to see the difference between an original surface and a fake one. The glare on the main surface tells us that there is a high possibility of blacktopping. The fine glass and plastic that the molds are generally produced with do not shine like this part. This is another indent created to visually fool those who are relying on their naked eye for inspection. The error that they made creating this circle is visible and the texture inside of the circle is neither smooth nor similar to the rest of the part. 如果我們接觸過越多的這種例子,我們就越容易辨別真正IC芯片表面與仿冒IC芯片表面的區(qū)別。Remember, the indents should be clean. The reason that they are not uniform here is because during their remarking process the materials get stuck in the indents. Any extra material in the indents does not belong there. 正如之前描述過的,真正IC芯片的模腔都會很干凈,但是從左圖中可以看出,該IC芯片的模腔很不均勻,原因是仿冒者在重新標(biāo)記過程中,涂敷在模腔內(nèi)的涂料堵住了,部分都凝結(jié)在一塊了。As previously described, the indents are typically smooth and therefore the writing within them should not be textured either. This is an extreme example because half of the indent is filled by the blacktopping material, but if you see letters with texture on them it is most likely blacktopped. 正如之前描述的那樣,左圖里IC芯片的模腔非常平滑,因此,模腔內(nèi)的字母標(biāo)志是不可能形成上面所描述的那種紋理/質(zhì)地。IC芯片紋理/質(zhì)地內(nèi)的細(xì)玻璃使得表面形成了“波峰”和“低谷”的外觀。This is a close up of how the surface of the part should look. It is very hard to see in pictures, but through a microscope the differences between a typical fake and an authentic part can best be described as。于是,仿冒者就想出這么一個方法:用一種特定的混合物涂敷在IC芯片原表面上,以制造假象。Same lot code on top. Manufactured in separate countries.從左圖中可以看出,IC芯片正面的批號代碼一樣,但是兩片IC芯片的原產(chǎn)地卻不一樣。但是,其實(shí)際原產(chǎn)地標(biāo)志為“MALAYSIA”(馬來西亞)。若是較小的芯片,一般來說,批號代碼內(nèi)就包括了原產(chǎn)地代碼信息,這種原產(chǎn)地代碼信息很難作為檢測仿冒IC芯片的決定性因素。如上面第二張圖片所示,如果模腔的標(biāo)記圖案是“BP”,則就不會被懷疑為仿冒IC芯片。These 3 parts are all marked identically on the top. The indents of these 3 have pletely different markings. Not only are they different, but they do not follow any pattern. It is not unmon on legitimate parts to see similar patterns that are not identical. For example, it can be a legitimate part if you had product, that like the first one had 2 letters in the indents, but they were different letters. It could have “”BP” on another part and not be a threat of counterfeit material. It is the same with the 3rd picture. You may have a “T” on another part without cause to worry. 上圖3個IC芯片的正面標(biāo)記都一樣,但是背面的這3個模腔的標(biāo)記都不一樣。This part is from the same lot code as the above part. You can see an additional problem with the differences in indents. One is much larger and another is non existent. If there is no “smoking gun” we are looking for more than one clue to make our final determination that the parts are counterfeits. In this case we have two fairly obvious anomalies which make our determination clear. 左圖的IC芯片和上圖IC芯片有著相同的批號代碼。如果用肉眼來觀察,左圖里的模腔看起來像是一個規(guī)則的模腔。而左圖的這個模腔的一邊緣已被“瀝青”填平,造成模腔內(nèi)部厚度不均勻。右圖的兩個封裝IC芯片中,左下方的兩個模腔看起來很相似,但是下方那個IC芯片,偏右邊的模腔根本就不明顯。這兩個IC芯片的型號標(biāo)記一樣,且兩個端口也相鄰,但是從圖片中我們可以看出,其中的一個IC芯片有3個模腔,而另外一個就只有2個模腔。因此,檢查模腔就成為檢測仿冒電子元件的首要方法。若是正宗的電子元件,通常在數(shù)據(jù)資料表上都會找到元件的具體條款要求。 Verification that the date code on the label match dates codes on the parts 驗(yàn)證標(biāo)簽上的生產(chǎn)日期代碼是否與元件本體上的生產(chǎn)日期代碼一致167。美國軍用標(biāo)準(zhǔn)MILSTD883 (method )要求電子元件標(biāo)記必須能承受得住這種混合溶劑的擦洗。檢測仿冒電子元件時,也要用到放大倍數(shù)至少為30倍的顯微鏡。盡管我們沒有直接從中國大陸地區(qū)采購(電子元件),但是我們每周都會收到仿冒電子元件。(例如,偽裝成原制造商,原產(chǎn)地,保證性能等)? Defective parts scrapped by the original part manufacture? 被原元件制造商報廢的有缺陷的那些元件? Previously used parts salvaged from scrapped assemblies? 從報廢組件中提取出來的先前使用過的元件… These are incidents that jeopardize the performance and reliability of electronics…….這些行為事件已危及到電子產(chǎn)品的性能及可靠性。先用箱子里的石頭撞擊線路板除去焊料,而后用Pilers夾鉗則可卸下芯片,然后再將芯片放入相應(yīng)的桶子里。左圖為廣東省汕頭市貴嶼鎮(zhèn)的一批工人正在從電子廢棄堆里撿取塑料。3. This requirement must flowdown to subcontractors that a
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