晶片的來料檢驗-wenkub
2023-03-13 23:42:43 本頁面
【正文】 r Inspection – PQI004 Chipouts on edge of die shall not perate into any active circuit area. Note: Active circuit area is defined as from outside edge of the bond pads inward, except where there is an active line in the design located beyond the outside edge of the bond pads Cracks 裂 縫 碎 片 邊 緣 不 可 穿 透 線 路 活 性 的 採 納 報 廢 Cracks shall not be longer than mil inside active circuit area that points toward operating metal or functional circuit element. 裂 縫 不 可 超 過 限 度 機 能 線 路 組 成 Cracks that do not point toward operating metal or functional circuit elements shall not exceed mils in length. (Silicon GaAs Die) 裂 縫 指 向 不 線 路 活 性 的 不 可 超 過 限 度 Discoloration in glassivation outer layer is harmless and shall be acceptable, providing it is not obscuring any other damage. There shall be no corrosion in metallization, or any other layers. Metallization having any localized discoloration shall be closely examined and shall be rejected, unless it is demonstrated to be a harmless film, glassivation interface, or other nonobscuring effects. Discoloration or Corrosion 變 色 腐 蝕 狀 態(tài) 玻 璃 鈍 化 There shall be no Conductive (opaque) Foreign Material on the top of unglassivated die that is large enough to bridge two or more adjacent metallization areas, and that cannot be removed Contamination or Foreign material 混 淆 外 來 料 子 不 透 明 橋 梁 Contamination or Foreign material There shall be no conductive (opaque) Foreign Material under the top glassivation layer of the die that is large e
教學(xué)課件相關(guān)推薦
鄂ICP備17016276號-1